Intel Wireless x3

Intel has announced a new wireless chip for 2007 which will integrate support for 802.11n, for WiMAX and for 3G HSDPA.

The new technology will be implemented in the next version of the Centrino Duo platform, which means that all future laptops equiped with this new technology will be able to exchange data in all 3 mentioned standards.

This is a great step towards the goal of "always-on": Wi-Fi for hotspots access, Wi-Max for Wide Range Networks (range of several kilometers) and 3G HSDPA (High Speed Downlink Packet Access) for access in areas with 3G mobile phone coverage.

Intel had previously announced the intention of providing a new mixed chip for Wi-Fi/WiMAX, but decided to include the 3G support due to a collaboration with Nokia.

From: Exame Informática (Portuguese)